全宇昕6651.TW AI Analysis
TW StockSemiconductor
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全宇昕（6651）Dividend Score
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Avg. Yield
5.63%
Avg. Volatility
37.86%
Avg. Filling Rate
80%
Avg. Filling Days
60.5
Consequent Years
5
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2021 | 3 | 0 | 3 | 1 | 2.36% | 3.73 | 83% |
| 2022 | 4 | 0.05 | 4.05 | 143 | 5.25% | 5.55 | 52% |
| 2023 | 6 | 0 | 6 | 81 | 8.06% | 3.31 | 68% |
| 2024 | 4 | 0 | 4 | 17 | 5.52% | 1.92 | 73% |
| 2025 | 7 | 0 | 7 | - | 6.93% | 2.01 | 85% |
Dividend Distribution and Dividend Yield
2021 Filling Days: 1
$3 (Incl. Stock Dividend $0)
2022 Filling Days: 143
$4 (Incl. Stock Dividend $0.0500149)
2023 Filling Days: 81
$6 (Incl. Stock Dividend $0)
2024 Filling Days: 17
$4 (Incl. Stock Dividend $0)
2025 Filling Days: 0
$7 (Incl. Stock Dividend $0)