晶碩6491.TW AI Analysis
TW StockBiotech. & Medical
(No presentation for 6491)
晶碩（6491）Dividend Score
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Avg. Yield
2.11%
Avg. Volatility
28.45%
Avg. Filling Rate
83.33%
Avg. Filling Days
7.6
Consequent Years
6
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2020 | 2.5 | 0 | 2.5 | 1 | 1.5% | 3.3 | 37% |
| 2021 | 5 | 0 | 5 | 1 | 0.91% | 7.43 | 49% |
| 2022 | 8.5 | 0 | 8.5 | 7 | 2.05% | 10.03 | 48% |
| 2023 | 10 | 0 | 10 | 19 | 2.69% | 10.06 | 45% |
| 2024 | 10 | 0 | 10 | 10 | 2.08% | 12.62 | 47% |
| 2025 | 11 | 0 | 11 | - | 3.42% | 10.29 | 47% |
Dividend Distribution and Dividend Yield
2020 Filling Days: 1
$2.5 (Incl. Stock Dividend $0)
2021 Filling Days: 1
$5 (Incl. Stock Dividend $0)
2022 Filling Days: 7
$8.5 (Incl. Stock Dividend $0)
2023 Filling Days: 19
$10 (Incl. Stock Dividend $0)
2024 Filling Days: 10
$10 (Incl. Stock Dividend $0)