信驊5274.TW AI Analysis
TW StockSemiconductor
(No presentation for 5274)
信驊（5274）Dividend Score
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Avg. Yield
1.69%
Avg. Volatility
54.49%
Avg. Filling Rate
92.31%
Avg. Filling Days
17.25
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 8 | 0 | 8 | 12 | 2.51% | 5.7 | 75% |
| 2017 | 12 | 0 | 12 | 2 | 1.92% | 6.8 | 91% |
| 2018 | 15 | 0 | 15 | - | 1.56% | 9.48 | 96% |
| 2019 | 18 | 0 | 18 | 3 | 3.04% | 10.74 | 89% |
| 2020 | 22 | 0 | 22 | 1 | 1.73% | 15.83 | 91% |
| 2021 | 26 | 0 | 26 | 10 | 1.2% | 16 | 89% |
| 2022 | 35 | 0.1 | 35.1 | 148 | 1.65% | 27.3 | 92% |
| 2023 | 45 | 0 | 45 | 1 | 1.71% | 11.3 | 81% |
| 2024 | 20 | 0 | 20 | 1 | 0.42% | 23.79 | 75% |
| 2025 | 52 | 0 | 52 | 1 | 1.16% | 40.11 | 76% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 12
$8 (Incl. Stock Dividend $0)
2017 Filling Days: 2
$12 (Incl. Stock Dividend $0)
2018 Filling Days: 0
$15 (Incl. Stock Dividend $0)
2019 Filling Days: 3
$18 (Incl. Stock Dividend $0)
2020 Filling Days: 1
$22 (Incl. Stock Dividend $0)