漢磊3707.TW AI Analysis
TW StockSemiconductor
(No presentation for 3707)
漢磊（3707）Dividend Score
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Avg. Yield
0.33%
Avg. Volatility
59.9%
Avg. Filling Rate
100%
Avg. Filling Days
1
Consequent Years
0
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2019 | 0.15 | 0 | 0.15 | 1 | 0.74% | -0.81 | 39% |
| 2020 | 0 | 0 | 0 | - | 0% | - | - |
| 2021 | 0 | 0 | 0 | - | 0% | - | - |
| 2022 | 0.35 | 0 | 0.35 | 1 | 0.4% | 1.33 | 50% |
| 2023 | 1 | 0 | 1 | 1 | 1.15% | 0.28 | 41% |
| 2024 | 0 | 0 | 0 | - | 0% | 0 | 0% |
| 2025 | 0 | 0 | 0 | - | 0% | 0 | 0% |
Dividend Distribution and Dividend Yield
2019 Filling Days: 1
$0.15 (Incl. Stock Dividend $0)
2020 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2021 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2022 Filling Days: 1
$0.35 (Incl. Stock Dividend $0)
2023 Filling Days: 1
$1 (Incl. Stock Dividend $0)