精材3374.TW AI Analysis
TW StockSemiconductor
(No presentation for 3374)
精材（3374）Dividend Score
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Avg. Yield
1.17%
Avg. Volatility
48.98%
Avg. Filling Rate
71.43%
Avg. Filling Days
1
Consequent Years
5
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 0.5 | 0 | 0.5 | 1 | 2.44% | -0.81 | 92% |
| 2017 | 0 | 0 | 0 | - | 0% | - | - |
| 2018 | 0 | 0 | 0 | - | 0% | - | - |
| 2019 | 0 | 0 | 0 | - | 0% | - | - |
| 2020 | 0 | 0 | 0 | - | 0% | - | - |
| 2021 | 2.5 | 0 | 2.5 | 1 | 1.77% | 3.09 | 39% |
| 2022 | 3 | 0 | 3 | - | 2.11% | 3.41 | 43% |
| 2023 | 3 | 0 | 3 | 1 | 2.38% | 1.57 | 41% |
| 2024 | 2 | 0 | 2 | 1 | 1.13% | 2.4 | 39% |
| 2025 | 2.5 | 0 | 2.5 | 1 | 1.83% | 1.5 | 41% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 1
$0.5 (Incl. Stock Dividend $0)
2017 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2018 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2019 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2020 Filling Days: 0
$0 (Incl. Stock Dividend $0)