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Xintec Inc. operates as a wafer level chip scale packaging company in Asia, the United States, and Europe. The company offers wafer level chip scale packaging for image and environmental sensors; wafer level post passivation interconnection for fingerprint and actuator sensors, micro-electromechanical components, power, analog, and RF components; and wafer testing services. It also provides optical sensor chip scale packaging services comprising side-wall interconnect and through silicon via RDL interconnect products, various glass thickness and filters, and glass bonding to wafer with or without cavity; FSI/BSI/stack wafer reconstruction for mobile, automotive, and consumer applications; and wafer reconstruction with a glass lid for automotive applications. In addition, the company provides micro-electromechanical systems sensor packaging services, such as wafer thinning and bonded wafer partial dicing to reveal bonding pad; CSP, using via last TSV to connect pad on wafer surface toward backside; and dry etching silicon to form large cavities to derive product performance needs; as well as 3D I/O redistribution, power ground enhancement, and dual side connection services. Its products are used in tablets, notebooks, computers, and medical applications. Xintec Inc. was incorporated in 1998 and is headquartered in Taoyuan City, Taiwan.
3374
精材
-4.67%
(-0.05)
The most recent financial report for 精材 (3374) covers the period of 2025Q4 and was published on 2025/12/31. This report is prepared according to IFRS/US GAAP standards and includes key financial indicators—Revenue, Profitability, Cash Flow, and Capital Structure. This information is essential for investors evaluating 3374's short-term business performance and financial health. For the latest updates on 3374's earnings releases, visit this page regularly.
According to historical valuation range analysis, 精材 (3374)'s current price-to-earnings (P/E) ratio is 24.1, placing it in the Overvalued zone on the P/E River chart. This level indicates that the market's expectations for future earnings are already reflected in the share price, with the valuation currently leaning optimistic. Investors are advised to further examine the company's fundamentals and its position in the industry cycle to validate whether the valuation is justified.
According to the latest financial report, 精材 (3374) reported an Operating Profit of 564.24M with an Operating Margin of 27.31% this period, representing a growth of 15.53% compared to the same period last year. Operating Profit reflects the company's core business efficiency and cost control, making it a key indicator for evaluating operational strength and profitability.
In the latest financial report, 精材 (3374) announced revenue of 2.07B, with a Year-Over-Year growth rate of 14.25%. Revenue growth can be driven by product mix changes, market share expansion, price adjustments, or international market penetration. Investors should also monitor gross margin and regional revenue distribution for a comprehensive view of growth quality and sustainability.
At the end of the period, 精材 (3374) held Total Cash and Cash Equivalents of 4.35B, accounting for 0.29 of total assets. Both current and quick ratios indicate robust short-term debt repayment ability. High cash reserves typically mean the company has strong liquidity, supporting operational needs, expansion investments, or shareholder returns.
In the latest report, 精材 (3374) achieved the “three margins increasing” benchmark, with a gross margin of 32.82%%, operating margin of 27.31%%, and net margin of 24.88%%. This demonstrates improvement in profitability, which is a key signal for fundamental analysis. Investors should consider margin trends alongside other financial indicators to assess 3374's profit trajectory and future growth potential.
According to the past four quarterly reports, 精材 (3374)'s earnings per share (EPS) shows a steady growth trend, with the latest EPS at 1.89. If EPS continues to rise due to revenue growth and cost optimization, it can support P/E valuation recovery and attract long-term investors.
精材 (3374)'s Free Cash Flow (FCF) for the period is -384.06M, calculated as Operating Cash Flow minus Capital Expenditures, representing a fall of 355.61% compared with the previous period. Positive FCF growth provides stable funding for dividends, debt repayment, or strategic acquisitions, and is an important measure of true profitability and shareholder return potential.