順德2351.TW AI Analysis
TW StockSemiconductor
(No presentation for 2351)
順德（2351）Dividend Score
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Avg. Yield
3.34%
Avg. Volatility
47.44%
Avg. Filling Rate
88.89%
Avg. Filling Days
12.58
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 2 | 0 | 2 | 6 | 5.1% | 1.83 | 63% |
| 2017 | 2.5 | 0 | 2.5 | 2 | 4.08% | 1.83 | 63% |
| 2018 | 2.5 | 0 | 2.5 | 2 | 3.08% | 2.18 | 64% |
| 2019 | 2.8 | 0 | 2.8 | 28 | 4.4% | 1.7 | 62% |
| 2020 | 1.8 | 0 | 1.8 | 6 | 3.98% | 0.65 | 67% |
| 2021 | 1.8 | 0 | 1.8 | 1 | 1.41% | 3.55 | 94% |
| 2022 | 3 | 0 | 3 | 3 | 2.61% | 2.92 | 64% |
| 2023 | 3.2 | 0 | 3.2 | 1 | 3.19% | 2.33 | 62% |
| 2024 | 2.6 | 0 | 2.6 | 1 | 2.23% | 2.1 | 64% |
| 2025 | 2.5 | 0 | 2.5 | 7 | 3.28% | 0.39 | 67% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 6
$2 (Incl. Stock Dividend $0)
2017 Filling Days: 2
$2.5 (Incl. Stock Dividend $0)
2018 Filling Days: 2
$2.5 (Incl. Stock Dividend $0)
2019 Filling Days: 28
$2.8 (Incl. Stock Dividend $0)
2020 Filling Days: 6
$1.8 (Incl. Stock Dividend $0)