千附8383.TW AI Analysis
TW StockSemiconductor
(No presentation for 8383)
千附（8383）Dividend Score
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Avg. Yield
5.92%
Avg. Volatility
34.83%
Avg. Filling Rate
100%
Avg. Filling Days
54.29
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 2.2 | 0 | 2.2 | 3 | 4.13% | 2.23 | 63% |
| 2017 | 2.7 | 0 | 2.7 | 110 | 5.39% | 2 | 60% |
| 2018 | 2.7 | 0 | 2.7 | 217 | 6.84% | 1.43 | 67% |
| 2019 | 2.5 | 0 | 2.5 | 224 | 6.49% | 1.43 | 98% |
| 2020 | 2.5 | 0 | 2.5 | 30 | 6.72% | 1.89 | 100% |
| 2021 | 2.5 | 0 | 2.5 | 112 | 6.33% | 1.41 | -199% |
| 2022 | 2.61 | 0 | 2.61 | 14 | 7.3% | 1.64 | 0% |
| 2023 | 2.5 | 0 | 2.5 | 154 | 6.38% | 0.32 | 94% |
| 2024 | 1.5 | 0 | 1.5 | 58 | 3.31% | 0.84 | 0% |
| 2025 | 2.5 | 0 | 2.5 | 17 | 6.3% | 1.09 | 72% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 3
$2.2 (Incl. Stock Dividend $0)
2017 Filling Days: 110
$2.7 (Incl. Stock Dividend $0)
2018 Filling Days: 217
$2.7 (Incl. Stock Dividend $0)
2019 Filling Days: 224
$2.5 (Incl. Stock Dividend $0)
2020 Filling Days: 30
$2.5 (Incl. Stock Dividend $0)