群聯8299.TW AI Analysis
TW StockSemiconductor
(No presentation for 8299)
群聯（8299）Dividend Score
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Avg. Yield
4.68%
Avg. Volatility
62.52%
Avg. Filling Rate
92.31%
Avg. Filling Days
31.25
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 12 | 0 | 12 | 194 | 4.41% | 9.58 | 59% |
| 2017 | 14 | 0 | 14 | 4 | 3.97% | 14.57 | 57% |
| 2018 | 17 | 0 | 17 | 26 | 6.9% | 10.75 | 58% |
| 2019 | 13 | 0 | 13 | 3 | 4.68% | 8.43 | 59% |
| 2020 | 13 | 0 | 13 | 72 | 4.33% | 15.64 | 56% |
| 2021 | 23 | 0 | 23 | 84 | 4.86% | 20.05 | 52% |
| 2022 | 23 | 0 | 23 | 8 | 6.18% | 30.8 | 56% |
| 2023 | 14.73 | 0 | 14.73 | 8 | 4.08% | 15.63 | 53% |
| 2024 | 13.08 | 0 | 13.08 | 1 | 2.36% | 21.23 | 73% |
| 2025 | 25.08 | 0 | 25.08 | 10 | 5.08% | 24.05 | 65% |
| 2026 | 6.23 | 0 | 6.23 | 1 | 0.56% | 19.9 | 65% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 194
$12 (Incl. Stock Dividend $0)
2017 Filling Days: 4
$14 (Incl. Stock Dividend $0)
2018 Filling Days: 26
$17 (Incl. Stock Dividend $0)
2019 Filling Days: 3
$13 (Incl. Stock Dividend $0)
2020 Filling Days: 72
$13 (Incl. Stock Dividend $0)