富鼎8261.TW AI Analysis
TW StockSemiconductor
(No presentation for 8261)
富鼎（8261）Dividend Score
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Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 1 | 0 | 1 | 6 | 4.56% | 0.75 | 86% |
| 2017 | 0.7 | 0 | 0.7 | 39 | 2.83% | -0.15 | 79% |
| 2018 | 0.45 | 0 | 0.45 | 1 | 0.97% | 0.91 | 93% |
| 2019 | 1 | 0 | 1 | 6 | 3.61% | 0.57 | 49% |
| 2020 | 0.5 | 0 | 0.5 | 1 | 1.77% | 1.54 | 74% |
| 2021 | 1 | 0 | 1 | 1 | 1.02% | 5.5 | 41% |
| 2022 | 6 | 0 | 6 | 2 | 5.36% | 3.53 | 75% |
| 2023 | 4.98 | 0 | 4.98 | 104 | 4.9% | 1.08 | 65% |
| 2024 | 2.49 | 0 | 2.49 | 73 | 2.92% | 1.89 | 89% |
| 2025 | 3.19 | 0 | 3.19 | 7 | 4.22% | 2.12 | 67% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 6
$1 (Incl. Stock Dividend $0)
2017 Filling Days: 39
$0.7 (Incl. Stock Dividend $0)
2018 Filling Days: 1
$0.45 (Incl. Stock Dividend $0)
2019 Filling Days: 6
$1 (Incl. Stock Dividend $0)
2020 Filling Days: 1
$0.5 (Incl. Stock Dividend $0)
Avg. Yield
3.22%
Avg. Volatility
41.76%
Avg. Filling Rate
100%
Avg. Filling Days
24.21
Consequent Years
10