南茂8150.TW AI Analysis
TW StockSemiconductor
(No presentation for 8150)
南茂（8150）Dividend Score
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Avg. Yield
5.22%
Avg. Volatility
50.83%
Avg. Filling Rate
75%
Avg. Filling Days
25
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 2.09 | 0 | 2.09 | 5 | 8.35% | 1.06 | 80% |
| 2017 | 1 | 0 | 1 | - | 3.05% | 3.2 | 17% |
| 2018 | 0.3 | 0 | 0.3 | 7 | 1.18% | 0.71 | 8% |
| 2019 | 1.2 | 0 | 1.2 | 1 | 4.44% | 2.02 | 79% |
| 2020 | 1.8 | 0 | 1.8 | 4 | 5.63% | 1.73 | 51% |
| 2021 | 2.2 | 0 | 2.2 | 4 | 3.86% | 3.08 | 68% |
| 2022 | 4.3 | 0 | 4.3 | - | 10.62% | 3.5 | 62% |
| 2023 | 2.3 | 0 | 2.3 | 49 | 6.28% | 1.14 | 50% |
| 2024 | 1.8 | 0 | 1.8 | - | 4.17% | 0.6 | 69% |
| 2025 | 1.23 | 0 | 1.23 | 16 | 4.61% | -0.5 | 61% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 5
$2.09 (Incl. Stock Dividend $0)
2017 Filling Days: 0
$1 (Incl. Stock Dividend $0)
2018 Filling Days: 7
$0.3 (Incl. Stock Dividend $0)
2019 Filling Days: 1
$1.2 (Incl. Stock Dividend $0)
2020 Filling Days: 4
$1.8 (Incl. Stock Dividend $0)