福懋科8131.TW AI Analysis
TW StockSemiconductor
(No presentation for 8131)
福懋科（8131）Dividend Score
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Avg. Yield
6.61%
Avg. Volatility
50.63%
Avg. Filling Rate
77.78%
Avg. Filling Days
64.57
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 2 | 0 | 2 | 87 | 9.39% | 1.02 | 78% |
| 2017 | 2 | 0 | 2 | 23 | 7.55% | 1.17 | 86% |
| 2018 | 2.5 | 0 | 2.5 | 245 | 7.27% | 1.64 | 79% |
| 2019 | 2.5 | 0 | 2.5 | 106 | 7.26% | 1.36 | 78% |
| 2020 | 2.2 | 0 | 2.2 | 168 | 5.84% | 1.65 | 77% |
| 2021 | 2.3 | 0 | 2.3 | - | 5.81% | 1.63 | 73% |
| 2022 | 2.5 | 0 | 2.5 | 16 | 6.99% | 2.59 | 71% |
| 2023 | 3.3 | 0 | 3.3 | - | 8.17% | 1.05 | 71% |
| 2024 | 0.9 | 0 | 0.9 | 3 | 2.46% | 1.43 | 75% |
| 2025 | 1.45 | 0 | 1.45 | 35 | 5.39% | -0.16 | 71% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 87
$2 (Incl. Stock Dividend $0)
2017 Filling Days: 23
$2 (Incl. Stock Dividend $0)
2018 Filling Days: 245
$2.5 (Incl. Stock Dividend $0)
2019 Filling Days: 106
$2.5 (Incl. Stock Dividend $0)
2020 Filling Days: 168
$2.2 (Incl. Stock Dividend $0)