翔名8091.TW AI Analysis
TW StockSemiconductor
(No presentation for 8091)
翔名（8091）Dividend Score
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Avg. Yield
5.86%
Avg. Volatility
36.68%
Avg. Filling Rate
90.91%
Avg. Filling Days
60.35
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 3 | 0 | 3 | 6 | 6.02% | 1.68 | 59% |
| 2017 | 3.63 | 0 | 3.63 | 4 | 5.56% | 2.64 | 89% |
| 2018 | 8.1 | 0 | 8.1 | 5 | 7.21% | 4.02 | 89% |
| 2019 | 5.63 | 0 | 5.63 | 232 | 8.23% | 1.87 | 88% |
| 2020 | 1.45 | 0 | 1.45 | 1 | 1.93% | 2.35 | 45% |
| 2021 | 2.58 | 0 | 2.58 | 5 | 4.38% | 1.5 | 66% |
| 2022 | 3.91 | 0 | 3.91 | 3 | 5.73% | 4.43 | 67% |
| 2023 | 7 | 0 | 7 | 142 | 7.41% | 3.22 | 76% |
| 2024 | 6 | 0 | 6 | 1 | 4.86% | 2.17 | 67% |
| 2025 | 8 | 0 | 8 | 96 | 7.31% | 1.2 | 96% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 6
$3 (Incl. Stock Dividend $0)
2017 Filling Days: 4
$3.63 (Incl. Stock Dividend $0)
2018 Filling Days: 5
$8.1 (Incl. Stock Dividend $0)
2019 Filling Days: 232
$5.63 (Incl. Stock Dividend $0)
2020 Filling Days: 1
$1.45 (Incl. Stock Dividend $0)