品安8088.TW AI Analysis
TW StockSemiconductor
(No presentation for 8088)
品安（8088）Dividend Score
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Avg. Yield
4.51%
Avg. Volatility
68.38%
Avg. Filling Rate
88.24%
Avg. Filling Days
18.13
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 1.48 | 0 | 1.48 | 2 | 5.69% | 0.45 | 89% |
| 2017 | 0.53 | 0.05 | 0.58 | 33 | 2.6% | -0.23 | 44% |
| 2018 | 0.19 | 0 | 0.19 | 1 | 1.34% | -0.2 | 47% |
| 2019 | 0.44 | 0 | 0.44 | 1 | 2.46% | 1.05 | 83% |
| 2020 | 2.08 | 0 | 2.08 | 105 | 7.13% | 1 | 88% |
| 2021 | 1.2 | 0 | 1.2 | 67 | 5.18% | 0.25 | 61% |
| 2022 | 1 | 0 | 1 | 4 | 5.83% | 1.51 | 61% |
| 2023 | 2.4 | 0 | 2.4 | 35 | 7.09% | 1.34 | 69% |
| 2024 | 2.6 | 0 | 2.6 | - | 6.33% | 0.21 | 99% |
| 2025 | 0.5 | 0 | 0.5 | 1 | 1.46% | -0.15 | 303% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 2
$1.48 (Incl. Stock Dividend $0)
2017 Filling Days: 33
$0.53 (Incl. Stock Dividend $0.0529262)
2018 Filling Days: 1
$0.19 (Incl. Stock Dividend $0)
2019 Filling Days: 1
$0.44 (Incl. Stock Dividend $0)
2020 Filling Days: 105
$2.08 (Incl. Stock Dividend $0)