宏捷科8086.TW AI Analysis
TW StockSemiconductor
(No presentation for 8086)
宏捷科（8086）Dividend Score
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Avg. Yield
2.62%
Avg. Volatility
53.02%
Avg. Filling Rate
100%
Avg. Filling Days
23.21
Consequent Years
2
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 4.75 | 0 | 4.75 | 158 | 7.84% | 2.21 | 61% |
| 2017 | 2.4 | 0 | 2.4 | 1 | 4.11% | 1.02 | 86% |
| 2018 | 1.4 | 0 | 1.4 | 1 | 1.93% | 1.54 | 89% |
| 2019 | 1.5 | 0 | 1.5 | 1 | 2.68% | 0.6 | 72% |
| 2020 | 1.7 | 0 | 1.7 | 1 | 1.91% | 2.2 | 72% |
| 2021 | 2.8 | 0 | 2.8 | 4 | 1.53% | 1.9 | 88% |
| 2022 | 2.8 | 0 | 2.8 | 3 | 4.12% | 0.38 | 65% |
| 2023 | 0 | 0 | 0 | - | 0% | - | - |
| 2024 | 1 | 0 | 1 | 1 | 0.98% | 2.15 | 90% |
| 2025 | 1.19 | 0 | 1.19 | 1 | 1.05% | 0.92 | 45% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 158
$4.75 (Incl. Stock Dividend $0)
2017 Filling Days: 1
$2.4 (Incl. Stock Dividend $0)
2018 Filling Days: 1
$1.4 (Incl. Stock Dividend $0)
2019 Filling Days: 1
$1.5 (Incl. Stock Dividend $0)
2020 Filling Days: 1
$1.7 (Incl. Stock Dividend $0)