佑華8024.TW AI Analysis
TW StockSemiconductor
(No presentation for 8024)
佑華（8024）Dividend Score
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Avg. Yield
2.63%
Avg. Volatility
39.21%
Avg. Filling Rate
73.33%
Avg. Filling Days
12.64
Consequent Years
0
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 0.2 | 0 | 0.2 | 1 | 1.98% | 0.12 | 25% |
| 2017 | 0.3 | 0 | 0.3 | 1 | 2.86% | 0.11 | 60% |
| 2018 | 0.3 | 0 | 0.3 | 1 | 2.84% | 0.02 | 76% |
| 2019 | 0.3 | 0 | 0.3 | 49 | 2.86% | 0.06 | 79% |
| 2020 | 0 | 0 | 0 | - | 0% | - | - |
| 2021 | 0 | 0 | 0 | - | 0% | - | - |
| 2022 | 1.4 | 0 | 1.4 | 13 | 7.76% | 1.28 | 83% |
| 2023 | 2 | 0 | 2 | - | 8.05% | -0.3 | 91% |
| 2024 | 0 | 0 | 0 | - | 0% | 0 | 0% |
| 2025 | 0 | 0 | 0 | - | 0% | 0 | 0% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 1
$0.2 (Incl. Stock Dividend $0)
2017 Filling Days: 1
$0.3 (Incl. Stock Dividend $0)
2018 Filling Days: 1
$0.3 (Incl. Stock Dividend $0)
2019 Filling Days: 49
$0.3 (Incl. Stock Dividend $0)
2020 Filling Days: 0
$0 (Incl. Stock Dividend $0)