矽創8016.TW AI Analysis
TW StockSemiconductor
(No presentation for 8016)
矽創（8016）Dividend Score
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Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 5 | 0 | 5 | 2 | 5.03% | 3.84 | 71% |
| 2017 | 6 | 0 | 6 | 12 | 6.72% | 3.12 | 69% |
| 2018 | 5.5 | 0 | 5.5 | 99 | 5.09% | 2.92 | 76% |
| 2019 | 5 | 0 | 5 | 2 | 3.56% | 4.5 | 72% |
| 2020 | 6.5 | 0 | 6.5 | 2 | 4.63% | 4.86 | 63% |
| 2021 | 7.5 | 0 | 7.5 | 1 | 2.56% | 19.55 | 65% |
| 2022 | 32 | 0 | 32 | 7 | 23.19% | 20.94 | 64% |
| 2023 | 22 | 0 | 22 | 33 | 9.8% | 7.41 | 73% |
| 2024 | 12 | 0 | 12 | - | 4.5% | 8.05 | 78% |
| 2025 | 12 | 0 | 12 | 13 | 6.02% | 7.02 | 78% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 2
$5 (Incl. Stock Dividend $0)
2017 Filling Days: 12
$6 (Incl. Stock Dividend $0)
2018 Filling Days: 99
$5.5 (Incl. Stock Dividend $0)
2019 Filling Days: 2
$5 (Incl. Stock Dividend $0)
2020 Filling Days: 2
$6.5 (Incl. Stock Dividend $0)
Avg. Yield
7.11%
Avg. Volatility
30.75%
Avg. Filling Rate
86.36%
Avg. Filling Days
37.05
Consequent Years
10