意德士7556.TW AI Analysis
TW StockSemiconductor
(No presentation for 7556)
意德士（7556）Dividend Score
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Avg. Yield
2.12%
Avg. Volatility
43.9%
Avg. Filling Rate
100%
Avg. Filling Days
53.2
Consequent Years
5
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2021 | 2.1 | 0.03 | 2.13 | 1 | 1.83% | 2.07 | 59% |
| 2022 | 2.4 | 0.04 | 2.44 | 1 | 2.22% | 2.78 | 52% |
| 2023 | 3 | 0.05 | 3.05 | 134 | 2.73% | 2.63 | 53% |
| 2024 | 2.5 | 0.05 | 2.55 | 118 | 1.86% | 2.55 | 53% |
| 2025 | 3.2 | 0.05 | 3.25 | 12 | 1.97% | 3.87 | 55% |
Dividend Distribution and Dividend Yield
2021 Filling Days: 1
$2.1 (Incl. Stock Dividend $0.03)
2022 Filling Days: 1
$2.4 (Incl. Stock Dividend $0.04)
2023 Filling Days: 134
$3 (Incl. Stock Dividend $0.05)
2024 Filling Days: 118
$2.5 (Incl. Stock Dividend $0.05)
2025 Filling Days: 12
$3.2 (Incl. Stock Dividend $0.05)