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天虹6937.TW AI Analysis

TW StockSemiconductor
(No presentation for 6937)

天虹（6937）Dividend Score

Oriented Analysis

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天虹（6937）Dividend Reference Factor

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Value

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Avg. Yield

0.83%

Avg. Volatility

54.11%

Avg. Filling Rate

100%

Avg. Filling Days

1

Consequent Years

2

Historical Dividend Policy

YearCash DividendStock DividendTotalFilling DaysDividend YieldEPSPayout Ratio
202420210.64%2.6444%
20252.102.111.02%1.0135%

Dividend Distribution and Dividend Yield

2024 Filling Days: 1

$2 (Incl. Stock Dividend $0)

0.64%

2025 Filling Days: 1

$2.1 (Incl. Stock Dividend $0)

1.02%