宏碩系統6895.TW AI Analysis
TW StockSemiconductor
(No presentation for 6895)
宏碩系統(6895)Dividend Score

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Avg. Yield
1.84%
Avg. Volatility
61.82%
Avg. Filling Rate
100%
Avg. Filling Days
1.5
Consequent Years
2
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2024 | 2.2 | 0 | 2.2 | 1 | 2.17% | 0.34 | 86% |
| 2025 | 2.3 | 0 | 2.3 | 2 | 1.5% | 0.37 | 90% |
Dividend Distribution and Dividend Yield
2024 Filling Days: 1
$2.2 (Incl. Stock Dividend $0)
2025 Filling Days: 2
$2.3 (Incl. Stock Dividend $0)