千附精密6829.TW AI Analysis
TW StockSemiconductor
(No presentation for 6829)
千附精密（6829）Dividend Score
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Avg. Yield
4.12%
Avg. Volatility
46.37%
Avg. Filling Rate
100%
Avg. Filling Days
12.25
Consequent Years
4
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2022 | 3.64 | 0 | 3.64 | 6 | 5.27% | 3.48 | 84% |
| 2023 | 5.4 | 0 | 5.4 | 34 | 4.18% | 1.66 | 90% |
| 2024 | 3 | 0 | 3 | 1 | 2.45% | 1.09 | 0% |
| 2025 | 5 | 0 | 5 | 8 | 4.59% | 1.61 | 88% |
Dividend Distribution and Dividend Yield
2022 Filling Days: 6
$3.64 (Incl. Stock Dividend $0)
2023 Filling Days: 34
$5.4 (Incl. Stock Dividend $0)
2024 Filling Days: 1
$3 (Incl. Stock Dividend $0)
2025 Filling Days: 8
$5 (Incl. Stock Dividend $0)