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來頡6799.TW AI Analysis

TW StockSemiconductor
(No presentation for 6799)

來頡（6799）Dividend Score

Oriented Analysis

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來頡（6799）Dividend Reference Factor

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Avg. Yield

2.26%

Avg. Volatility

46.02%

Avg. Filling Rate

100%

Avg. Filling Days

8

Consequent Years

4

Historical Dividend Policy

YearCash DividendStock DividendTotalFilling DaysDividend YieldEPSPayout Ratio
20222.7302.7362.15%4.5340%
202330312.09%2.4541%
20242.9702.9712.6%1.6758%
20251.9901.99242.2%0.8970%

Dividend Distribution and Dividend Yield

2022 Filling Days: 6

$2.73 (Incl. Stock Dividend $0)

2.15%

2023 Filling Days: 1

$3 (Incl. Stock Dividend $0)

2.09%

2024 Filling Days: 1

$2.97 (Incl. Stock Dividend $0)

2.6%

2025 Filling Days: 24

$1.99 (Incl. Stock Dividend $0)

2.2%