應廣6716.TW AI Analysis
TW StockSemiconductor
(No presentation for 6716)
應廣（6716）Dividend Score
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Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2020 | 2.73 | 0 | 2.73 | 6 | 3.91% | 2.44 | 85% |
| 2021 | 4 | 0.1 | 4.1 | - | 1.69% | 5.71 | 76% |
| 2022 | 7.5 | 0.1 | 7.6 | - | 7.21% | 5.64 | 65% |
| 2023 | 4.5 | 0.1 | 4.6 | 84 | 5% | 0.38 | 60% |
| 2024 | 2 | 0 | 2 | 1 | 1.65% | 3.31 | 103% |
| 2025 | 3.38 | 0 | 3.38 | - | 6.19% | 0.47 | 80% |
Dividend Distribution and Dividend Yield
2020 Filling Days: 6
$2.73 (Incl. Stock Dividend $0)
2021 Filling Days: 0
$4 (Incl. Stock Dividend $0.1)
2022 Filling Days: 0
$7.5 (Incl. Stock Dividend $0.1)
2023 Filling Days: 84
$4.5 (Incl. Stock Dividend $0.1)
2024 Filling Days: 1
$2 (Incl. Stock Dividend $0)
Avg. Yield
4.27%
Avg. Volatility
57.54%
Avg. Filling Rate
50%
Avg. Filling Days
30.33
Consequent Years
6