天擎6708.TW AI Analysis
TW StockSemiconductor
(No presentation for 6708)
天擎（6708）Dividend Score
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Avg. Yield
0.97%
Avg. Volatility
39.6%
Avg. Filling Rate
100%
Avg. Filling Days
1
Consequent Years
0
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2023 | 0.9 | 0 | 0.9 | 1 | 1.9% | -0.6 | 78% |
| 2024 | 0.4 | 0 | 0.4 | 1 | 0.99% | -0.03 | 0% |
| 2025 | 0 | 0 | 0 | - | 0% | 0 | 0% |
Dividend Distribution and Dividend Yield
2023 Filling Days: 1
$0.9 (Incl. Stock Dividend $0)
2024 Filling Days: 1
$0.4 (Incl. Stock Dividend $0)
2025 Filling Days: 0
$0 (Incl. Stock Dividend $0)