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廣閎科6693.TW AI Analysis

TW StockSemiconductor
(No presentation for 6693)

廣閎科（6693）Dividend Score

Oriented Analysis

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廣閎科（6693）Dividend Reference Factor

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Historical Dividend Policy

YearCash DividendStock DividendTotalFilling DaysDividend YieldEPSPayout Ratio
20222.2202.22172.63%2.686%
202320213.26%0.3382%
202410111.34%1.97129%
2025202103.53%-1.7460%

Dividend Distribution and Dividend Yield

2022 Filling Days: 17

$2.22 (Incl. Stock Dividend $0)

2.63%

2023 Filling Days: 1

$2 (Incl. Stock Dividend $0)

3.26%

2024 Filling Days: 1

$1 (Incl. Stock Dividend $0)

1.34%

2025 Filling Days: 10

$2 (Incl. Stock Dividend $0)

3.53%

Avg. Yield

2.69%

Avg. Volatility

39.62%

Avg. Filling Rate

100%

Avg. Filling Days

7.25

Consequent Years

4