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Hua Hsu Silicon Materials Co., Ltd. researches and develops, manufactures, and sells electroplated diamond wires. The company also provides solar silicon chip cutting services. Its products are primarily used for cutting hard and brittle materials, such as sapphire, silicon materials, magnetic materials, etc. The company was formerly known as Giga Diamond Materials Corporation and changed its name to Hua Hsu Silicon Materials Co., Ltd. in July 2022. The company was founded in 2015 and is based in Hsinchu City, Taiwan.
6682
華旭先進
-2.79%
(-0.03)
The most recent financial report for 華旭先進 (6682) covers the period of 2025Q2 and was published on 2025/06/30. This report is prepared according to IFRS/US GAAP standards and includes key financial indicators—Revenue, Profitability, Cash Flow, and Capital Structure. This information is essential for investors evaluating 6682's short-term business performance and financial health. For the latest updates on 6682's earnings releases, visit this page regularly.
At the end of the period, 華旭先進 (6682) held Total Cash and Cash Equivalents of 148.07M, accounting for 0.09 of total assets. Both current and quick ratios indicate robust short-term debt repayment ability. High cash reserves typically mean the company has strong liquidity, supporting operational needs, expansion investments, or shareholder returns.
In the latest report, 華旭先進 (6682) did not achieve the “three margins increasing” benchmark, with a gross margin of -4.37%%, operating margin of -25.3%%, and net margin of -47.48%%. This demonstrates limited improvement in profitability, which is a key signal for fundamental analysis. Investors should consider margin trends alongside other financial indicators to assess 6682's profit trajectory and future growth potential.