鈺太6679.TW AI Analysis
TW StockSemiconductor
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鈺太（6679）Dividend Score
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Avg. Yield
2.28%
Avg. Volatility
45.73%
Avg. Filling Rate
100%
Avg. Filling Days
1.14
Consequent Years
7
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2019 | 1.6 | 0 | 1.6 | 1 | 1.55% | 1.81 | 60% |
| 2020 | 2.44 | 0 | 2.44 | 1 | 1.27% | 3.09 | 51% |
| 2021 | 4.99 | 0 | 4.99 | 1 | 1.34% | 7.11 | 68% |
| 2022 | 7.13 | 0 | 7.13 | 1 | 2.38% | 7.5 | 62% |
| 2023 | 9 | 0 | 9 | 1 | 3.29% | 1.01 | 94% |
| 2024 | 5.5 | 0 | 5.5 | 1 | 1.46% | 2.86 | 79% |
| 2025 | 9.17 | 0 | 9.17 | 2 | 4.67% | 0.45 | 102% |
Dividend Distribution and Dividend Yield
2019 Filling Days: 1
$1.6 (Incl. Stock Dividend $0)
2020 Filling Days: 1
$2.44 (Incl. Stock Dividend $0)
2021 Filling Days: 1
$4.99 (Incl. Stock Dividend $0)
2022 Filling Days: 1
$7.13 (Incl. Stock Dividend $0)
2023 Filling Days: 1
$9 (Incl. Stock Dividend $0)