均華6640.TW AI Analysis
TW StockSemiconductor
(No presentation for 6640)
均華(6640)Dividend Score

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Avg. Yield
4.77%
Avg. Volatility
59.47%
Avg. Filling Rate
100%
Avg. Filling Days
9.57
Consequent Years
7
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2019 | 3 | 0 | 3 | 4 | 8.01% | 1.43 | 97% |
| 2020 | 3 | 0 | 3 | 42 | 7.08% | 1.75 | 99% |
| 2021 | 3 | 0 | 3 | 1 | 2.41% | 3.11 | 91% |
| 2022 | 5 | 0 | 5 | 2 | 5.68% | 6.31 | 86% |
| 2023 | 6 | 0 | 6 | 16 | 6.76% | 1.53 | 74% |
| 2024 | 5 | 0 | 5 | 1 | 0.85% | 7.2 | 98% |
| 2025 | 15 | 0 | 15 | 1 | 2.59% | 5.13 | 102% |
Dividend Distribution and Dividend Yield
2019 Filling Days: 4
$3 (Incl. Stock Dividend $0)
2020 Filling Days: 42
$3 (Incl. Stock Dividend $0)
2021 Filling Days: 1
$3 (Incl. Stock Dividend $0)
2022 Filling Days: 2
$5 (Incl. Stock Dividend $0)
2023 Filling Days: 16
$6 (Incl. Stock Dividend $0)