晶心科6533.TW AI Analysis
TW StockSemiconductor
(No presentation for 6533)
晶心科（6533）Dividend Score
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Avg. Yield
0.28%
Avg. Volatility
43.63%
Avg. Filling Rate
100%
Avg. Filling Days
1.67
Consequent Years
0
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2018 | 0 | 0.05 | 0.05 | 1 | 0% | 0.2 | 0% |
| 2019 | 0.7 | 0 | 0.7 | 1 | 0.55% | 0.04 | 72% |
| 2020 | 0.34 | 0 | 0.34 | 2 | 0.22% | -1.3 | 91% |
| 2021 | 0.74 | 0 | 0.74 | 1 | 0.16% | 2.06 | 90% |
| 2022 | 2.85 | 0 | 2.85 | 4 | 1.04% | 3.88 | 89% |
| 2023 | 1.5 | 0 | 1.5 | 1 | 0.31% | -1.91 | 21% |
| 2024 | 0 | 0 | 0 | - | 0% | 0 | 0% |
| 2025 | 0 | 0 | 0 | - | 0% | 0 | 0% |
Dividend Distribution and Dividend Yield
2018 Filling Days: 1
$0 (Incl. Stock Dividend $0.05)
2019 Filling Days: 1
$0.7 (Incl. Stock Dividend $0)
2020 Filling Days: 2
$0.34 (Incl. Stock Dividend $0)
2021 Filling Days: 1
$0.74 (Incl. Stock Dividend $0)
2022 Filling Days: 4
$2.85 (Incl. Stock Dividend $0)