瑞耘6532.TW AI Analysis
TW StockSemiconductor
(No presentation for 6532)
瑞耘（6532）Dividend Score
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Avg. Yield
4.21%
Avg. Volatility
40.17%
Avg. Filling Rate
100%
Avg. Filling Days
16.11
Consequent Years
9
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2017 | 0.79 | 0 | 0.79 | 5 | 3.13% | 0.63 | 76% |
| 2018 | 1.1 | 0 | 1.1 | 1 | 3.14% | 1.75 | 60% |
| 2019 | 2.3 | 0 | 2.3 | 34 | 8.21% | 1.2 | 67% |
| 2020 | 1.6 | 0 | 1.6 | 1 | 2.25% | 2.07 | 68% |
| 2021 | 2 | 0 | 2 | 83 | 4.63% | 1.02 | 70% |
| 2022 | 1.8 | 0 | 1.8 | 3 | 4.32% | 2.37 | 68% |
| 2023 | 2.69 | 0 | 2.69 | 5 | 4.29% | 1.66 | 56% |
| 2024 | 2.4 | 0 | 2.4 | 3 | 3.63% | 1.67 | 67% |
| 2025 | 2.6 | 0 | 2.6 | 10 | 4.34% | 1.28 | 67% |
Dividend Distribution and Dividend Yield
2017 Filling Days: 5
$0.79 (Incl. Stock Dividend $0)
2018 Filling Days: 1
$1.1 (Incl. Stock Dividend $0)
2019 Filling Days: 34
$2.3 (Incl. Stock Dividend $0)
2020 Filling Days: 1
$1.6 (Incl. Stock Dividend $0)
2021 Filling Days: 83
$2 (Incl. Stock Dividend $0)