捷敏-KY6525.TW AI Analysis
TW StockSemiconductor
(No presentation for 6525)
捷敏-KY（6525）Dividend Score
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Avg. Yield
5.78%
Avg. Volatility
29.07%
Avg. Filling Rate
60%
Avg. Filling Days
66.5
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 3.3 | 0 | 3.3 | 179 | 5.57% | 2.72 | 65% |
| 2017 | 3.8 | 0 | 3.8 | 15 | 6.63% | 2.39 | 71% |
| 2018 | 3 | 0.1 | 3.1 | - | 3.81% | 2.75 | 51% |
| 2019 | 4 | 0.1 | 4.1 | - | 6.07% | 2.42 | 61% |
| 2020 | 3.5 | 0 | 3.5 | 113 | 5.72% | 2.54 | 68% |
| 2021 | 4.5 | 0 | 4.5 | 10 | 4.05% | 3.05 | 85% |
| 2022 | 5.5 | 0 | 5.5 | - | 7.2% | 4.03 | 83% |
| 2023 | 5.5 | 0 | 5.5 | - | 7.44% | 2.44 | 76% |
| 2024 | 3.5 | 0 | 3.5 | 27 | 5.13% | 1.21 | 80% |
| 2025 | 4.2 | 0 | 4.2 | 55 | 6.21% | 1.42 | 82% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 179
$3.3 (Incl. Stock Dividend $0)
2017 Filling Days: 15
$3.8 (Incl. Stock Dividend $0)
2018 Filling Days: 0
$3 (Incl. Stock Dividend $0.1)
2019 Filling Days: 0
$4 (Incl. Stock Dividend $0.1)
2020 Filling Days: 113
$3.5 (Incl. Stock Dividend $0)