穎崴6515.TW AI Analysis
TW StockSemiconductor
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穎崴（6515）Dividend Score
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Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2021 | 12.98 | 0 | 12.98 | 10 | 4.88% | 3.89 | 83% |
| 2022 | 10.98 | 0 | 10.98 | 3 | 3.12% | 9.64 | 77% |
| 2023 | 22 | 0 | 22 | 1 | 2.68% | 8.14 | 69% |
| 2024 | 11 | 0 | 11 | 2 | 1.14% | 5.81 | 81% |
| 2025 | 25 | 0 | 25 | 40 | 1.95% | 22.97 | 81% |
Dividend Distribution and Dividend Yield
2021 Filling Days: 10
$12.98 (Incl. Stock Dividend $0)
2022 Filling Days: 3
$10.98 (Incl. Stock Dividend $0)
2023 Filling Days: 1
$22 (Incl. Stock Dividend $0)
2024 Filling Days: 2
$11 (Incl. Stock Dividend $0)
2025 Filling Days: 40
$25 (Incl. Stock Dividend $0)
Avg. Yield
2.75%
Avg. Volatility
66.14%
Avg. Filling Rate
100%
Avg. Filling Days
11.2
Consequent Years
5