環球晶6488.TW AI Analysis
TW StockSemiconductor
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環球晶（6488）Dividend Score
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Avg. Yield
3.91%
Avg. Volatility
54.39%
Avg. Filling Rate
100%
Avg. Filling Days
17
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 5 | 0 | 5 | 31 | 7.46% | 2 | 89% |
| 2017 | 2.5 | 0 | 2.5 | 2 | 1.04% | 4.17 | 82% |
| 2018 | 10 | 0 | 10 | 3 | 1.96% | 14.36 | 83% |
| 2019 | 25 | 0 | 25 | 59 | 7.63% | 17.02 | 80% |
| 2020 | 25 | 0 | 25 | 9 | 6.23% | 14.42 | 70% |
| 2021 | 18 | 0 | 18 | 20 | 2.32% | 22.69 | 60% |
| 2022 | 16 | 0 | 16 | 4 | 2.46% | 18.76 | 54% |
| 2023 | 16 | 0 | 16 | 46 | 3.3% | 28.9 | 42% |
| 2024 | 19 | 0 | 19 | 1 | 3.34% | 29.73 | 44% |
| 2025 | 11 | 0 | 11 | 12 | 3.29% | 13.81 | 53% |
| 2026 | 2 | 0 | 2 | 1 | 0.49% | 10.68 | 53% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 31
$5 (Incl. Stock Dividend $0)
2017 Filling Days: 2
$2.5 (Incl. Stock Dividend $0)
2018 Filling Days: 3
$10 (Incl. Stock Dividend $0)
2019 Filling Days: 59
$25 (Incl. Stock Dividend $0)
2020 Filling Days: 9
$25 (Incl. Stock Dividend $0)