訊芯-KY6451.TW AI Analysis
TW StockSemiconductor
(No presentation for 6451)
訊芯-KY（6451）Dividend Score
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Avg. Yield
2.86%
Avg. Volatility
59.29%
Avg. Filling Rate
75%
Avg. Filling Days
18.67
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 6 | 0 | 6 | 17 | 6.67% | 5.15 | 57% |
| 2017 | 5.4 | 0 | 5.4 | 37 | 5.24% | 1.11 | 59% |
| 2018 | 0.94 | 0 | 0.94 | 1 | 0.63% | -0.2 | 89% |
| 2019 | 2.33 | 0 | 2.33 | 3 | 2.13% | 1.69 | 80% |
| 2020 | 3.67 | 0 | 3.67 | 104 | 2.94% | 1.88 | 61% |
| 2021 | 4.1 | 0 | 4.1 | - | 3.73% | 3.26 | 61% |
| 2022 | 2.56 | 0 | 2.56 | 3 | 3.8% | 0.49 | 68% |
| 2023 | 1.17 | 0 | 1.17 | 1 | 1.09% | 1.27 | 60% |
| 2024 | 4.92 | 0 | 4.92 | 1 | 2.16% | 0.03 | 0% |
| 2025 | 0.36 | 0 | 0.36 | 1 | 0.25% | -1.64 | 0% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 17
$6 (Incl. Stock Dividend $0)
2017 Filling Days: 37
$5.4 (Incl. Stock Dividend $0)
2018 Filling Days: 1
$0.94 (Incl. Stock Dividend $0)
2019 Filling Days: 3
$2.33 (Incl. Stock Dividend $0)
2020 Filling Days: 104
$3.67 (Incl. Stock Dividend $0)