矽力*-KY6415.TW AI Analysis
TW StockSemiconductor
(No presentation for 6415)
矽力*-KY（6415）Dividend Score
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Avg. Yield
0.64%
Avg. Volatility
53.29%
Avg. Filling Rate
91.67%
Avg. Filling Days
18.27
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 2.01 | 0 | 2.01 | 1 | 0.53% | 7.52 | 13% |
| 2017 | 4.92 | 0 | 4.92 | 1 | 0.83% | 10.26 | 29% |
| 2018 | 5.98 | 0 | 5.98 | - | 0.81% | 10.17 | 29% |
| 2019 | 6.52 | 0 | 6.52 | 1 | 1.01% | 11.75 | 32% |
| 2020 | 7.48 | 0 | 7.48 | 1 | 0.43% | 15.58 | 30% |
| 2021 | 10.46 | 0 | 10.46 | 1 | 0.26% | 27.07 | 30% |
| 2022 | 17.98 | 0 | 17.98 | 1 | 0.54% | 16.74 | 30% |
| 2023 | 4.49 | 0 | 4.49 | 1 | 0.89% | 0.57 | 28% |
| 2024 | 1.96 | 0 | 1.96 | 2 | 0.59% | 0.2 | 101% |
| 2025 | 2.4 | 0 | 2.4 | 1 | 0.55% | 0.93 | 41% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 1
$2.01 (Incl. Stock Dividend $0)
2017 Filling Days: 1
$4.92 (Incl. Stock Dividend $0)
2018 Filling Days: 0
$5.98 (Incl. Stock Dividend $0)
2019 Filling Days: 1
$6.52 (Incl. Stock Dividend $0)
2020 Filling Days: 1
$7.48 (Incl. Stock Dividend $0)