晶焱6411.TW AI Analysis
TW StockSemiconductor
(No presentation for 6411)
晶焱（6411）Dividend Score
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Avg. Yield
4.06%
Avg. Volatility
42.12%
Avg. Filling Rate
91.67%
Avg. Filling Days
21.18
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 1.8 | 0 | 1.8 | 6 | 4.17% | 1.57 | 62% |
| 2017 | 1.8 | 0.06 | 1.86 | 10 | 1.87% | 2.41 | 37% |
| 2018 | 3.2 | 0.06 | 3.26 | - | 3.12% | 3.87 | 50% |
| 2019 | 4.17 | 0.06 | 4.23 | 6 | 5.36% | 3.5 | 55% |
| 2020 | 4.8 | 0 | 4.8 | 92 | 5.38% | 2.69 | 76% |
| 2021 | 5.03 | 0 | 5.03 | 1 | 3.49% | 3.94 | 75% |
| 2022 | 7.16 | 0 | 7.16 | 4 | 6.83% | 4.59 | 70% |
| 2023 | 3.27 | 0 | 3.27 | 1 | 2.95% | 2.67 | 70% |
| 2024 | 2.46 | 0 | 2.46 | 1 | 2.64% | 2.21 | 60% |
| 2025 | 3.18 | 0 | 3.18 | 14 | 4.79% | 1.2 | 70% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 6
$1.8 (Incl. Stock Dividend $0)
2017 Filling Days: 10
$1.8 (Incl. Stock Dividend $0.06)
2018 Filling Days: 0
$3.2 (Incl. Stock Dividend $0.06)
2019 Filling Days: 6
$4.17 (Incl. Stock Dividend $0.059518)
2020 Filling Days: 92
$4.8 (Incl. Stock Dividend $0)