沛亨6291.TW AI Analysis
TW StockSemiconductor
(No presentation for 6291)
沛亨（6291）Dividend Score
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Avg. Yield
1.22%
Avg. Volatility
66.75%
Avg. Filling Rate
83.33%
Avg. Filling Days
63
Consequent Years
3
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 0 | 0 | 0 | - | 0% | - | - |
| 2017 | 0 | 0 | 0 | - | 0% | - | - |
| 2018 | 0 | 0 | 0 | - | 0% | - | - |
| 2019 | 0 | 0 | 0 | - | 0% | - | - |
| 2020 | 0 | 0 | 0 | - | 0% | - | - |
| 2021 | 0 | 0 | 0 | - | 0% | - | - |
| 2022 | 0 | 0 | 0 | - | 0% | - | - |
| 2023 | 1.5 | 0 | 1.5 | 2 | 0.85% | 4.22 | 35% |
| 2024 | 8 | 0 | 8 | - | 5.21% | 2.01 | 78% |
| 2025 | 5.8 | 0 | 5.8 | 77 | 6.12% | 1.05 | 95% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2017 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2018 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2019 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2020 Filling Days: 0
$0 (Incl. Stock Dividend $0)