安鈦克6276.TW AI Analysis
TW StockComputer & Periphera
(No presentation for 6276)
安鈦克（6276）Dividend Score
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Avg. Yield
2.26%
Avg. Volatility
59.96%
Avg. Filling Rate
90.91%
Avg. Filling Days
37.1
Consequent Years
0
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 0 | 0 | 0 | - | 0% | - | - |
| 2017 | 0 | 0 | 0 | - | 0% | - | - |
| 2018 | 0 | 0 | 0 | - | 0% | - | - |
| 2019 | 0 | 0 | 0 | - | 0% | - | - |
| 2020 | 0.64 | 0 | 0.64 | 1 | 2.32% | 1.35 | 72% |
| 2021 | 3 | 0 | 3 | - | 8.72% | 1.69 | 87% |
| 2022 | 1 | 0 | 1 | 239 | 5.09% | -0.3 | 91% |
| 2023 | 0.7 | 0 | 0.7 | 1 | 3.21% | 0.78 | 93% |
| 2024 | 2.27 | 0 | 2.27 | 40 | 3.25% | -0.31 | 89% |
| 2025 | 0 | 0 | 0 | - | 0% | 0 | 0% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2017 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2018 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2019 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2020 Filling Days: 1
$0.64 (Incl. Stock Dividend $0)