久元6261.TW AI Analysis
TW StockSemiconductor
(No presentation for 6261)
久元（6261）Dividend Score
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Avg. Yield
6.69%
Avg. Volatility
24.36%
Avg. Filling Rate
72.73%
Avg. Filling Days
63.44
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 3.3 | 0 | 3.3 | 240 | 6.98% | 2.03 | 89% |
| 2017 | 3.1 | 0 | 3.1 | 2 | 5.83% | 2.84 | 90% |
| 2018 | 4.1 | 0 | 4.1 | - | 8.6% | 1.19 | 102% |
| 2019 | 3 | 0 | 3 | 69 | 7.1% | 0.75 | 84% |
| 2020 | 3 | 0 | 3 | 65 | 5.15% | 1.91 | 96% |
| 2021 | 4 | 0 | 4 | 43 | 4.62% | 4.26 | 97% |
| 2022 | 5 | 0 | 5 | - | 7.5% | 4.68 | 59% |
| 2023 | 5 | 0 | 5 | 74 | 8.71% | 1.11 | 75% |
| 2024 | 4 | 0 | 4 | 38 | 5.62% | 2.35 | 98% |
| 2025 | 4 | 0 | 4 | - | 6.84% | 1.31 | 98% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 240
$3.3 (Incl. Stock Dividend $0)
2017 Filling Days: 2
$3.1 (Incl. Stock Dividend $0)
2018 Filling Days: 0
$4.1 (Incl. Stock Dividend $0)
2019 Filling Days: 69
$3 (Incl. Stock Dividend $0)
2020 Filling Days: 65
$3 (Incl. Stock Dividend $0)