矽格6257.TW AI Analysis
TW StockSemiconductor
(No presentation for 6257)
矽格（6257）Dividend Score
Browsing restrictions can be lifted for a fee.
Join Growin Stock Community!
Browsing restrictions can be lifted for a fee.
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 1.6 | 0 | 1.6 | 127 | 6.94% | 0.86 | 47% |
| 2017 | 1.65 | 0 | 1.65 | 65 | 6.14% | 0.97 | 76% |
| 2018 | 1.76 | 0 | 1.76 | - | 5.01% | 1.55 | 69% |
| 2019 | 2.06 | 0 | 2.06 | 29 | 7.06% | 1.22 | 35% |
| 2020 | 2.2 | 0 | 2.2 | 93 | 4.97% | 1.89 | 36% |
| 2021 | 2.87 | 0 | 2.87 | 13 | 4.58% | 2.82 | 49% |
| 2022 | 4.13 | 0 | 4.13 | 5 | 8.89% | 4 | 49% |
| 2023 | 4.2 | 0 | 4.2 | 20 | 7.95% | 1.62 | 63% |
| 2024 | 2.6 | 0 | 2.6 | 2 | 3.43% | 3.25 | 70% |
| 2025 | 4.04 | 0 | 4.04 | 8 | 5.34% | 2.26 | 44% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 127
$1.6 (Incl. Stock Dividend $0)
2017 Filling Days: 65
$1.65 (Incl. Stock Dividend $0)
2018 Filling Days: 0
$1.76 (Incl. Stock Dividend $0)
2019 Filling Days: 29
$2.06 (Incl. Stock Dividend $0)
2020 Filling Days: 93
$2.2 (Incl. Stock Dividend $0)
Avg. Yield
6.03%
Avg. Volatility
44.13%
Avg. Filling Rate
78.26%
Avg. Filling Days
40.67
Consequent Years
10