力成6239.TW AI Analysis
TW StockSemiconductor
(No presentation for 6239)
力成(6239)Dividend Score

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Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 3.5 | 0 | 3.5 | 5 | 5.12% | 2.66 | 49% |
| 2017 | 4 | 0 | 4 | 70 | 4.26% | 3.31 | 53% |
| 2018 | 4.5 | 0 | 4.5 | - | 5.19% | 3.82 | 60% |
| 2019 | 4.8 | 0 | 4.8 | 33 | 5.94% | 2.78 | 60% |
| 2020 | 4.5 | 0 | 4.5 | 120 | 4.55% | 4.36 | 60% |
| 2021 | 5 | 0 | 5 | 4 | 4.55% | 5.09 | 58% |
| 2022 | 6.8 | 0 | 6.8 | 145 | 8.13% | 6.59 | 58% |
| 2023 | 7 | 0 | 7 | 83 | 6.76% | 3.31 | 61% |
| 2024 | 7 | 0 | 7 | - | 4.47% | 4.77 | 66% |
| 2025 | 7 | 0 | 7 | 32 | 5.3% | 2.88 | 78% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 5
$3.5 (Incl. Stock Dividend $0)
2017 Filling Days: 70
$4 (Incl. Stock Dividend $0)
2018 Filling Days: 0
$4.5 (Incl. Stock Dividend $0)
2019 Filling Days: 33
$4.8 (Incl. Stock Dividend $0)
2020 Filling Days: 120
$4.5 (Incl. Stock Dividend $0)
Avg. Yield
5.43%
Avg. Volatility
47.21%
Avg. Filling Rate
73.91%
Avg. Filling Days
44.18
Consequent Years
10