驊訊6237.TW AI Analysis
TW StockSemiconductor
(No presentation for 6237)
驊訊（6237）Dividend Score
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Avg. Yield
1.1%
Avg. Volatility
47.21%
Avg. Filling Rate
90.48%
Avg. Filling Days
17.21
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 0.25 | 0 | 0.25 | 1 | 0.88% | 0.16 | 20% |
| 2017 | 0.25 | 0 | 0.25 | 2 | 1.07% | 2.52 | 29% |
| 2018 | 0.5 | 0 | 0.5 | 1 | 1.95% | 0.24 | 22% |
| 2019 | 0.25 | 0 | 0.25 | 3 | 1.5% | -0.03 | -76% |
| 2020 | 0.25 | 0 | 0.25 | 1 | 0.78% | 0.19 | -41% |
| 2021 | 1 | 0 | 1 | 1 | 0.93% | 3.8 | 41% |
| 2022 | 1 | 0 | 1 | 1 | 2.17% | 0.04 | 17% |
| 2023 | 0.25 | 0 | 0.25 | 1 | 0.61% | -0.6 | -15% |
| 2024 | 0.25 | 0 | 0.25 | 1 | 0.46% | 0 | -19% |
| 2025 | 0.25 | 0 | 0.25 | 3 | 0.65% | -1.27 | -92% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 1
$0.25 (Incl. Stock Dividend $0)
2017 Filling Days: 2
$0.25 (Incl. Stock Dividend $0)
2018 Filling Days: 1
$0.5 (Incl. Stock Dividend $0)
2019 Filling Days: 3
$0.25 (Incl. Stock Dividend $0)
2020 Filling Days: 1
$0.25 (Incl. Stock Dividend $0)