旺玖6233.TW AI Analysis
TW StockSemiconductor
(No presentation for 6233)
旺玖（6233）Dividend Score
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Avg. Yield
0.41%
Avg. Volatility
47.69%
Avg. Filling Rate
75%
Avg. Filling Days
14.5
Consequent Years
3
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 0 | 0 | 0 | - | 0% | - | - |
| 2017 | 0 | 0 | 0 | - | 0% | - | - |
| 2018 | 0 | 0 | 0 | - | 0% | - | - |
| 2019 | 0 | 0 | 0 | - | 0% | - | - |
| 2020 | 0 | 0 | 0 | - | 0% | - | - |
| 2021 | 0 | 0 | 0 | - | 0% | - | - |
| 2022 | 0 | 0 | 0 | - | 0% | - | - |
| 2023 | 0.48 | 0 | 0.48 | 1 | 1.76% | -0.06 | 96% |
| 2024 | 0.21 | 0 | 0.21 | 1 | 0.56% | 0.08 | 28% |
| 2025 | 0.36 | 0 | 0.36 | 10 | 1.76% | -0.15 | 102% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2017 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2018 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2019 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2020 Filling Days: 0
$0 (Incl. Stock Dividend $0)