研通6229.TW AI Analysis
TW StockSemiconductor
(No presentation for 6229)
研通（6229）Dividend Score
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Avg. Yield
4.31%
Avg. Volatility
39.11%
Avg. Filling Rate
82.61%
Avg. Filling Days
44.53
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 0.04 | 0 | 0.04 | 8 | 0.31% | 0.19 | 88% |
| 2017 | 0.67 | 0 | 0.67 | 2 | 5.18% | 0.06 | 106% |
| 2018 | 0.46 | 0 | 0.46 | 175 | 3.2% | -0.05 | 63% |
| 2019 | 0.93 | 0 | 0.93 | 44 | 7.31% | 0.02 | 121% |
| 2020 | 0.54 | 0 | 0.54 | 10 | 3.61% | 0.34 | 90% |
| 2021 | 1.02 | 0 | 1.02 | - | 1.96% | 1.78 | 77% |
| 2022 | 2.5 | 0 | 2.5 | 7 | 10.33% | 1.83 | 56% |
| 2023 | 1.6 | 0 | 1.6 | 67 | 5.78% | -0.46 | 72% |
| 2024 | 0.5 | 0 | 0.5 | - | 1.19% | 0.44 | 924% |
| 2025 | 1 | 0 | 1 | 16 | 4.24% | -0.29 | 186% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 8
$0.04 (Incl. Stock Dividend $0)
2017 Filling Days: 2
$0.67 (Incl. Stock Dividend $0)
2018 Filling Days: 175
$0.46 (Incl. Stock Dividend $0)
2019 Filling Days: 44
$0.93 (Incl. Stock Dividend $0)
2020 Filling Days: 10
$0.54 (Incl. Stock Dividend $0)