旺矽6223.TW AI Analysis
TW StockSemiconductor
(No presentation for 6223)
旺矽（6223）Dividend Score
Browsing restrictions can be lifted for a fee.
旺矽（6223）Dividend Reference Factor
Avg. Yield
3.64%
Avg. Volatility
60.72%
Avg. Filling Rate
90.91%
Avg. Filling Days
15
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 3 | 0 | 3 | 15 | 3.63% | 2.56 | 81% |
| 2017 | 4.18 | 0 | 4.18 | - | 5.18% | 2.33 | 59% |
| 2018 | 0.5 | 0 | 0.5 | 1 | 0.74% | 0.59 | 27% |
| 2019 | 2 | 0 | 2 | 2 | 3.11% | 3.5 | 48% |
| 2020 | 2.49 | 0 | 2.49 | 1 | 2.08% | 4.57 | 47% |
| 2021 | 4.47 | 0 | 4.47 | 1 | 3.53% | 3.2 | 58% |
| 2022 | 4 | 0 | 4 | 2 | 5.29% | 6.46 | 54% |
| 2023 | 7 | 0 | 7 | 1 | 4.17% | 6.62 | 54% |
| 2024 | 7.5 | 0 | 7.5 | 1 | 1.27% | 4.18 | 54% |
| 2025 | 16.01 | 0 | 16.01 | 1 | 1.53% | 14.35 | 66% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 15
$3 (Incl. Stock Dividend $0)
2017 Filling Days: 0
$4.18 (Incl. Stock Dividend $0)
2018 Filling Days: 1
$0.5 (Incl. Stock Dividend $0)
2019 Filling Days: 2
$2 (Incl. Stock Dividend $0)
2020 Filling Days: 1
$2.49 (Incl. Stock Dividend $0)