日揚6208.TW AI Analysis
TW StockSemiconductor
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日揚（6208）Dividend Score
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Avg. Yield
4.33%
Avg. Volatility
32.82%
Avg. Filling Rate
85.71%
Avg. Filling Days
47.33
Consequent Years
1
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 0.2 | 0 | 0.2 | 3 | 1.74% | 0.58 | 29% |
| 2017 | 0.8 | 0 | 0.8 | 2 | 4.48% | 0.82 | 62% |
| 2018 | 1.4 | 0 | 1.4 | - | 5.09% | 1.07 | 77% |
| 2019 | 1.7 | 0 | 1.7 | 86 | 6.81% | 1.22 | 71% |
| 2020 | 1.7 | 0 | 1.7 | 59 | 6.63% | 0.57 | 74% |
| 2021 | 1.99 | 0 | 1.99 | 3 | 4.83% | 0.71 | 79% |
| 2022 | 2.2 | 0 | 2.2 | 7 | 4.11% | 0.96 | 135% |
| 2023 | 2.7 | 0 | 2.7 | 15 | 5.13% | 0.74 | 44% |
| 2024 | 0 | 0 | 0 | - | 0% | - | - |
| 2025 | 2 | 0 | 2 | 42 | 4.44% | 1.39 | 35% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 3
$0.2 (Incl. Stock Dividend $0)
2017 Filling Days: 2
$0.8 (Incl. Stock Dividend $0)
2018 Filling Days: 0
$1.4 (Incl. Stock Dividend $0)
2019 Filling Days: 86
$1.7 (Incl. Stock Dividend $0)
2020 Filling Days: 59
$1.7 (Incl. Stock Dividend $0)