合晶6182.TW AI Analysis
TW StockSemiconductor
(No presentation for 6182)
合晶（6182）Dividend Score
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Avg. Yield
2.49%
Avg. Volatility
51.8%
Avg. Filling Rate
93.33%
Avg. Filling Days
14
Consequent Years
0
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 0 | 0 | 0 | - | 0% | - | - |
| 2017 | 0 | 0 | 0 | - | 0% | - | - |
| 2018 | 0.38 | 0 | 0.38 | 1 | 0.81% | 1.45 | 64% |
| 2019 | 2.5 | 0 | 2.5 | 13 | 7.12% | 1.68 | 67% |
| 2020 | 1.8 | 0 | 1.8 | 4 | 5.33% | 0.49 | 75% |
| 2021 | 1.1 | 0 | 1.1 | 13 | 1.61% | 0.74 | 108% |
| 2022 | 1.35 | 0 | 1.35 | 2 | 2.88% | 1.9 | 70% |
| 2023 | 2.5 | 0 | 2.5 | 102 | 5.41% | 0.81 | 62% |
| 2024 | 0.65 | 0 | 0.65 | 1 | 1.74% | 0.01 | 62% |
| 2025 | 0 | 0 | 0 | - | 0% | 0 | 0% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2017 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2018 Filling Days: 1
$0.38 (Incl. Stock Dividend $0)
2019 Filling Days: 13
$2.5 (Incl. Stock Dividend $0)
2020 Filling Days: 4
$1.8 (Incl. Stock Dividend $0)