頎邦6147.TW AI Analysis
TW StockSemiconductor
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頎邦（6147）Dividend Score
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Avg. Yield
6.17%
Avg. Volatility
29.55%
Avg. Filling Rate
90%
Avg. Filling Days
30.22
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 2.1 | 0 | 2.1 | 2 | 5.09% | 0.92 | 66% |
| 2017 | 2.1 | 0 | 2.1 | 30 | 4.13% | 1.19 | 68% |
| 2018 | 2.35 | 0 | 2.35 | 3 | 3.56% | 1.73 | 68% |
| 2019 | 3.5 | 0 | 3.5 | 98 | 5.49% | 3.04 | 51% |
| 2020 | 4.2 | 0 | 4.2 | 75 | 6.86% | 2.5 | 32% |
| 2021 | 3.8 | 0 | 3.8 | 5 | 5.39% | 3.96 | 5% |
| 2022 | 6 | 0 | 6 | 102 | 11.13% | 4.75 | 6% |
| 2023 | 5.5 | 0 | 5.5 | 29 | 8.58% | 2.83 | 24% |
| 2024 | 3.75 | 0 | 3.75 | - | 4.95% | 1.66 | 70% |
| 2025 | 3.75 | 0 | 3.75 | - | 6.55% | 1.46 | 68% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 2
$2.1 (Incl. Stock Dividend $0)
2017 Filling Days: 30
$2.1 (Incl. Stock Dividend $0)
2018 Filling Days: 3
$2.35 (Incl. Stock Dividend $0)
2019 Filling Days: 98
$3.5 (Incl. Stock Dividend $0)
2020 Filling Days: 75
$4.2 (Incl. Stock Dividend $0)