合邦6103.TW AI Analysis
TW StockSemiconductor
(No presentation for 6103)
合邦（6103）Dividend Score
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Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 0 | 0 | 0 | - | 0% | - | - |
| 2017 | 0 | 0 | 0 | - | 0% | - | - |
| 2018 | 0 | 0 | 0 | - | 0% | - | - |
| 2019 | 0 | 0 | 0 | - | 0% | - | - |
| 2020 | 0 | 0 | 0 | - | 0% | - | - |
| 2021 | 0 | 0 | 0 | - | 0% | - | - |
| 2022 | 0 | 0 | 0 | - | 0% | - | - |
| 2023 | 0 | 0 | 0 | - | 0% | - | - |
| 2024 | 0 | 0 | 0 | - | 0% | - | - |
| 2025 | 0.19 | 0 | 0.19 | 1 | 0.45% | -1.34 | 6% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2017 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2018 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2019 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2020 Filling Days: 0
$0 (Incl. Stock Dividend $0)
Avg. Yield
0.04%
Avg. Volatility
33.96%
Avg. Filling Rate
75%
Avg. Filling Days
77.33
Consequent Years
1