中美晶5483.TW AI Analysis
TW StockSemiconductor
(No presentation for 5483)
中美晶（5483）Dividend Score
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Avg. Yield
4.55%
Avg. Volatility
45.89%
Avg. Filling Rate
87.1%
Avg. Filling Days
23.33
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 1.5 | 0 | 1.5 | 6 | 4.23% | 0.87 | 86% |
| 2017 | 1.5 | 0 | 1.5 | 2 | 3.03% | -0.48 | 0% |
| 2018 | 3 | 0 | 3 | 4 | 2.68% | 2.93 | 0% |
| 2019 | 3 | 0 | 3 | 2 | 3.53% | -0.76 | 70% |
| 2020 | 5 | 0 | 5 | 74 | 4.85% | 4.96 | 67% |
| 2021 | 9 | 0 | 9 | 1 | 4.81% | 8.46 | 51% |
| 2022 | 8 | 0 | 8 | 2 | 4.35% | 8.44 | 31% |
| 2023 | 9 | 0 | 9 | 46 | 5.41% | 11.62 | 55% |
| 2024 | 14.1 | 0 | 14.1 | 24 | 6.87% | 9.9 | 21% |
| 2025 | 6.5 | 0 | 6.5 | 8 | 5.78% | 5.8 | 78% |
| 2026 | 1 | 0 | 1 | - | 0.81% | 4.07 | 78% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 6
$1.5 (Incl. Stock Dividend $0)
2017 Filling Days: 2
$1.5 (Incl. Stock Dividend $0)
2018 Filling Days: 4
$3 (Incl. Stock Dividend $0)
2019 Filling Days: 2
$3 (Incl. Stock Dividend $0)
2020 Filling Days: 74
$5 (Incl. Stock Dividend $0)